When evaluating an AI visual inspection system, most engineers focus on detection accuracy, camera resolution, and throughput. The deployment architecture question, whether inference runs at the edge or in the cloud, often gets treated as a secondary decision. It should not. Where your AI model runs determines whether your inspection system can function at all under real production conditions.
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General Inspection has announced the launch of the Gi-307, a powerful new fastener inspection and sorting platform designed to redefine quality control for manufacturers producing mission-critical screws and bolts.
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Zaber Technologies has announced the DMA Objective Focus Stage, a compact, linear motor solution for microscope system builders and OEM manufacturers. The DMA delivers 50 nm repeatability and 10 nm minimum incremental moves, providing comparable precision to piezo stages at one-third the cost.
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Nikon Corporation has launched the ECLIPSE LV100AMS, a new one‑click automated microscope designed to simplify industrial inspection and quality control. Built on Nikon’s established industrial microscope platforms, the LV100AMS combines fully automated inspection with AI‑powered image analysis, enabling manufacturers to improve consistency, increase inspection speed, and strengthen confidence in inspection outcomes.
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Allied Vision has announced the 3DPIXA evo compact CXP, a series of high-performance line scan 3D stereo cameras that fuse GPU – accelerated stereo algorithms with high-resolution 2D color imaging for simultaneous 3D depth map data and RGB output in machine vision inspection.
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Airy3D has announced that its DepthIQ SDK is supported on the MediaTek Genio Series of System-on-Chips, enabling compact and cost-efficient passive 3D vision solutions for embedded AI vision applications across robotics, industrial, retail, and smart devices.
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A new technique called quantum diamond microscopy (QDM), now entering commercial deployment in semiconductor laboratories across the US, Europe, and Asia, offers the industry something it has lacked: direct, non-destructive measurement of electrical current flow inside a fully assembled device.
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Nikon Corporation has expanded its NEXIV 3D Confocal series with the launch of the new NEXIV VMF-K6561, a high-speed optical measurement system designed to support the growing demand for large-format panel-level package (PLP) inspection in semiconductor and precision engineering applications.
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MVTec Software GmbH and ZEISS have announced a strategic collaboration. As part of this partnership, ZEISS is integrating the machine vision software MVTec HALCON as the foundation for image processing in ZEISS Blockwise, the new software platform for automated microscopy.
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As manufacturing environments become increasingly digitised, the role of metrology is undergoing a fundamental shift. No longer confined to post-process inspection, measurement is evolving into a real-time, data-driven function at the heart of production.
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