Physik Instrumente (PI), a leader in photonics, piezo and nanopositioning technologies, highlights its P-733 XY piezo scanning stage as a high-performance solution for applications that demand ultrafast, nanometer-precise motion, including image stabilization, pixel-shift imaging, and resolution enhancement.
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Inspectis AB has announced the launch of a new Large-Aperture Ring Light, HD-124-LA, developed for use with Inspectis’ digital microscopes.
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Peak Technologies has announced the launch of Peak Automation Intelligence, an integrated AI-powered platform designed to help manufacturers and operators of warehouses and distribution centers modernize their operations with real-time visibility, automated data capture, and high-speed material flow intelligence.
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In today’s aircraft production, precision is everything. Every hole and every fixing point must be precisely positioned to ensure safety and quality. As part of the DiCADeMA project (Digital Cabin Architectures and Design for Manufacturing) led by the German Aerospace Centre (DLR), a novel, fully digitally networked process has been developed.
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The DIKUQ project has developed a semi-automated process chain for forming steel sheets for shipbuilding. Fraunhofer IOF designed a novel inline 3D measurement system that can digitally capture workpieces in less than half a second and reconstruct them as 3D images. The system reduces the workload for specialists and minimizes quality fluctuations.
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Artificial intelligence is increasingly embedded in industrial inspection, but its role is often misunderstood. In practice, AI is rarely a standalone solution. Instead, it functions as one element within a broader verification architecture, deployed selectively where conventional approaches reach their limits.
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Vision Engineering, a leading global manufacturer of ergonomic inspection and non-contact metrology systems, has announced the launch of EDGE: a new range of compact vision measurement systems designed to bridge the gap between manual inspection and full-scale CNC automation.
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ZEISS has unveiled the new ZEISS Crossbeam 750 focused ion beam-scanning electron microscope (FIB-SEM) that is optimized for demanding sample preparation. It provides a live, high-resolution “see while you mill” view at any imaging and milling condition to enable immediate feedback and eliminate milling interruptions for uniform first-pass transmission electron microscopy (TEM) lamellae and precise FIB cross sections.
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QuantumDiamonds GmbH, the developer of quantum sensing based semiconductor inspection systems, has announced the successful installation of its QD m.1 system at Eurofins EAG Laboratories in Sunnyvale, California. The deployment marks the first North American installation of a commercial quantum diamond microscopy (QDM) system and extends non-destructive magnetic current imaging to failure analysis laboratories serving the US semiconductor market.
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Cognex Corporation has announced the release of a new report ‘How AI Is Transforming Machine Vision Through Performance and Simplicity’. The report draws on firsthand insights from over 500 manufacturers, integrators, and OEMs to explore how artificial intelligence is making production lines smarter, more accurate, and easier to run.
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