Nordson Unveils Acoustic Inspection System for Advanced Semiconductor Manufacturing
Nordson Test & Inspection recently introduced its new SonoFlex Acoustic Microscopy Inspection (AMI) system at SEMICON WEST. Designed for back-end advanced semiconductor manufacturing, the system combines high-resolution acoustic imaging with AI-powered defect analysis to improve inspection throughput and process insight.
The new SonoFlex Acoustic Microscopy Inspection (AMI) system incorporates Nordson’s ThruScan imaging technology, together with advanced pulser and transducer technologies, to deliver high-resolution imaging and accurate defect detection at increased scanning speeds. For small-panel applications, Nordson reports scanning speeds up to twice those of conventional solutions while maintaining image quality.
SonoFlex is designed to address the inspection requirements of increasingly complex semiconductor packaging processes, where identifying internal defects is critical to product reliability and manufacturing yield. Its acoustic microscopy capabilities support the detection and analysis of defects that may not be readily identifiable through surface inspection alone.
The platform’s modular architecture is intended to simplify maintenance and serviceability while supporting scalable multi-system configurations. According to Nordson, these configurations can increase throughput by up to eight times, enabling manufacturers to expand inspection capacity in line with production requirements.
SonoFlex is powered by FlexCore software and Nordson Intelligence Multi-Gate Image Analysis (MGIA) technology. These tools automate defect identification, help isolate true void counts and support the analysis of complex devices and manufacturing processes. By combining imaging with intelligent analytics, the system is designed to provide more consistent defect assessment while reducing the effort required to interpret inspection results.
The integration of acoustic imaging and AI-powered analysis also provides manufacturers with additional information for understanding process performance and identifying potential sources of defects. This can support process optimisation, improved product quality and more efficient inspection workflows.
The launch of SonoFlex extends Nordson Test & Inspection’s portfolio of technologies aimed at meeting the evolving inspection and metrology demands of advanced semiconductor manufacturing, particularly as packaging architectures and production requirements become more complex.
For more information: www.nordson.com
