FIBERSCOPE has reintroduced the iX3D 3D measurement video borescope, a modular remote visual inspection system that has been developed in the U.S. with German optical engineering and is intended for use in cases where detecting an internal defect alone is insufficient.
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Rigaku Corporation has announced the launch of the CT Lab HR160, a high-resolution X-ray computed tomography (CT) system for battery, semiconductor devices, electronic components, and advanced materials analysis. The system is developed in collaboration with Excillum AB, the global source for X-ray innovation.
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Renishaw has launched a new family of RLE laser interferometer encoder systems. The new product range comprises three systems – RLE100, RLE200 and RLE300 – providing precision position feedback for a wide range of semiconductor manufacturing motion control applications.
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FARO CREAFORM will showcase its latest portable metrology technologies at IMTS 2026 (Booth 134730), from September 14 to 19 in Chicago. Visitors can explore solutions designed to enhance inspection efficiency, support quality workflows, and enable data-driven decision-making across the production floor.
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The Association for Advancing Automation (A3) has announced the speaker lineup and agenda for its Advanced Vision & AI Conference, September 23–24, 2026, in Santa Clara, California. Featuring experts from Waymo, NVIDIA, Tesla, Intrinsic, GE Vernova, Intel, FANUC, Cognex, Siemens Digital Industries, and more, the two-day conference will focus on how vision and AI technologies are being deployed across manufacturing and other industrial environments.
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QuantumDiamonds GmbH (QD) has demonstrated a novel method for imaging electrical current inside a semiconductor structure without making physical contact with it. The technique removes the constraint that has kept quantum-sensing based current imaging inside the failure analysis lab and marks the foundational step on QD’s path toward inline inspection in high-volume manufacturing.
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Surface roughness directly impacts sealing performance, friction, wear, coating adhesion, fatigue life, and overall product quality. Yet many manufacturing specifications still rely on Ra, a parameter developed nearly a century ago from a single 2D measurement trace. As modern surfaces become increasingly engineered and complex, manufacturers are discovering that traditional roughness measurements do not always provide the complete picture.
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SHINING 3D has introduced EinScan Trak, a 3D scanning and optical tracking system that combines large-area scanning with a detachable handheld laser scanner. The system is designed to allow users to capture medium and large-sized objects using optical tracking, while also providing a handheld configuration for smaller components and difficult-to-access features.
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PI (Physik Instrumente), a leader in piezo nanopositioning and air bearing technology, offers the P-733 XYZ piezo nanopositioning stage, delivering 0.1 nm (1 Å) positioning resolution for demanding applications in super-resolution microscopy, atomic force microscopy (AFM), surface nanometrology, and advanced imaging.
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Gear manufacturing is increasingly moving toward a model in which inspection is no longer a downstream quality-control activity, but an integral part of the production process. At IMTS 2026, Gleason will demonstrate how advanced gear metrology, functional testing and digital manufacturing technologies are supporting this transition.
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