Leica Microsystems, a Danaher company and a leading provider of microscopy and scientific solutions, and Cognex Corporation, a leader in industrial machine vision, has announced Aivaro AI Feature Detection, a new AI-powered software module that automatically identifies, classifies and measures defects and other features of interest during inspection.
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Ajile Light Industries is positioning its DepthScan 3D Inspection Platform as a flexible approach to moving dimensional inspection beyond the metrology laboratory and closer to the production line. Built around the company’s DepthScan structured-light 3D imager, the platform can be configured for laboratory, beside-line or inline inspection, including automated 100% inspection applications.
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Cognex Corporation has announced the launch of the In-Sight 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, improve traceability, and maintain throughput.
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PiXARGUS has introduced ProfilControl 7 RubberFleX, a new inline inspection system developed specifically for the dimensional and surface inspection requirements of rubber profile extrusion.
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Leopard Imaging, a leader in AI perception and spatial intelligence solution design and manufacturing, together with Lumotive, a pioneer in programmable optical semiconductor technology, have announced Sirius Max, a next-generation solid-state 3D LiDAR designed for advanced AI perception, robotics, industrial automation, autonomous machines, and intelligent edge systems.
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The increasing adoption of advanced semiconductor packaging is placing greater emphasis on wafer geometry and thickness measurement, as manufacturers seek tighter process control across increasingly complex production flows.
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Cognex Corporation, a global leader in industrial machine vision, has announced that it has entered into a definitive agreement to acquire RealSense, a market leader in depth-sensing cameras and vision technology for robotic perception and Physical AI.
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USI has announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, and smart factory initiatives.
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For decades, industrial metrology has been built around a familiar premise: measure a sample, verify compliance, and assume the rest of production follows suit. Coordinate Measuring Machines (CMMs), hard gauges, and tactile sensors have delivered exceptional precision, but they have also reinforced a workflow constrained by speed. Measuring every component has simply not been practical.
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ZEISS has introduced the ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers understand samples faster. Combining X-ray microscopy and microCT in a single platform, the system delivers multi-scale imaging, guided workflows, and automated AI-enabled reconstruction for efficient non-destructive 3D imaging.
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