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Metrology and Quality News – Online Magazine

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ZEISS Gemini 4 Electron Optics offer Superior Resolution and Signal-to-Noise Ratio

ZEISS has unveiled the new ZEISS Crossbeam 750 focused ion beam-scanning electron microscope (FIB-SEM) that is optimized for demanding sample preparation. It provides a live, high-resolution “see while you mill” view at any imaging and milling condition to enable immediate feedback and eliminate milling interruptions for uniform first-pass transmission electron microscopy (TEM) lamellae and precise FIB cross sections.  

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First Quantum Diamond Microscopy System Lands in US for Advanced Chip Failure Analysis

QuantumDiamonds GmbH, the developer of quantum sensing based semiconductor inspection systems, has announced the successful installation of its QD m.1 system at Eurofins EAG Laboratories in Sunnyvale, California. The deployment marks the first North American installation of a commercial quantum diamond microscopy (QDM) system and extends non-destructive magnetic current imaging to failure analysis laboratories serving the US semiconductor market.

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Redefining In-Line Inspection for High-Volume Manufacturing

Traditional quality control methods are becoming outdated due to inefficiencies, reliance on manual labor, subjective assessments, tooling obstructions, and human error. In additive manufacturing, the challenges of complex geometries, tight tolerances, and scalability demands make quality control even more difficult. AM-Flow aims to solve this with fully automated, lights-out production powered by cutting-edge technology.

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Real-Time Measurement Reduces Scrap in Plastic Profiles

The solution developed in the project, SURFinloop, uses low‑cost scattering sensors that continuously record surface data and compares it with digital reference models known as digital twins. Modular software evaluates the data and detects geometric tolerance deviations with high precision. The system then feeds this information directly back into the production process in a closed loop.

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