Hexagon Manufacturing Intelligence has announced the launch of its next-generation OPTIV S optical coordinate measuring machine (CMM). The redesigned platform delivers significant improvements in speed, accuracy and usability while introducing a new generation of AI-assisted measurement technologies.
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Rigaku Corporation has announced the launch of the CT Lab HR160, a high-resolution X-ray computed tomography (CT) system for battery, semiconductor devices, electronic components, and advanced materials analysis. The system is developed in collaboration with Excillum AB, the global source for X-ray innovation.
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Manufacturers looking to understand where artificial intelligence is headed and how to put it to work can hear directly from some of the world’s leading technology companies at IMTS 2026 – The International Manufacturing Technology Show, Sept. 14-19 at McCormick Place in Chicago. IMTS+ Main Stage presentations from Amazon Web Services (AWS), Google Cloud, Microsoft, and Siemens will discuss industrial AI from multiple perspectives, as well as share success stories in manufacturing applications.
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Renishaw has launched a new family of RLE laser interferometer encoder systems. The new product range comprises three systems – RLE100, RLE200 and RLE300 – providing precision position feedback for a wide range of semiconductor manufacturing motion control applications.
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Metrology Brew newsletter features a summary of headline metrology and smart manufacturing news from the past 7 days.
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FARO CREAFORM will showcase its latest portable metrology technologies at IMTS 2026 (Booth 134730), from September 14 to 19 in Chicago. Visitors can explore solutions designed to enhance inspection efficiency, support quality workflows, and enable data-driven decision-making across the production floor.
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Computed tomography (CT) is increasingly being used to inspect complex automotive components, including lightweight structures, castings and battery systems. As component geometries become more complicated, CT analysis must provide more than internal visualization, with engineers requiring quantitative tools to identify defects, measure features and document results.
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The Association for Advancing Automation (A3) has announced the speaker lineup and agenda for its Advanced Vision & AI Conference, September 23–24, 2026, in Santa Clara, California. Featuring experts from Waymo, NVIDIA, Tesla, Intrinsic, GE Vernova, Intel, FANUC, Cognex, Siemens Digital Industries, and more, the two-day conference will focus on how vision and AI technologies are being deployed across manufacturing and other industrial environments.
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QuantumDiamonds GmbH (QD) has demonstrated a novel method for imaging electrical current inside a semiconductor structure without making physical contact with it. The technique removes the constraint that has kept quantum-sensing based current imaging inside the failure analysis lab and marks the foundational step on QD’s path toward inline inspection in high-volume manufacturing.
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Surface roughness directly impacts sealing performance, friction, wear, coating adhesion, fatigue life, and overall product quality. Yet many manufacturing specifications still rely on Ra, a parameter developed nearly a century ago from a single 2D measurement trace. As modern surfaces become increasingly engineered and complex, manufacturers are discovering that traditional roughness measurements do not always provide the complete picture.
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