Teledyne e2v has announced Flash 1K2 and Flash 8K, the latest additions to its Flash CMOS image sensor family. The new sensors join the existing Flash 2K and Flash 4K devices, extending the portfolio from 1K to 8K resolutions.
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Stratasys recently announced it has been awarded $7.8 million of funding through The 2026 America Makes and the Department of War (DoW) Organic Industrial Base (OIB) Modernization Challenge that focuses on advancing additive manufacturing and related technologies to support defense manufacturing modernization.
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Anthropic has introduced a research preview of the Model Hardware Standard (MHS), a specification designed to allow AI agents to communicate with and control physical equipment including robotic arms, microscopes and other laboratory and manufacturing systems.
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Rockwell Automation has announced an API-enabled integration between Plex Quality Management System (QMS) and FactoryTalk Analytics VisionAI. The integration expands AI-driven quality management and reflects Rockwell’s continued investment in artificial intelligence and elastic MES solutions.
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FIBERSCOPE has reintroduced the iX3D 3D measurement video borescope, a modular remote visual inspection system that has been developed in the U.S. with German optical engineering and is intended for use in cases where detecting an internal defect alone is insufficient.
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Rigaku Corporation has announced the launch of the CT Lab HR160, a high-resolution X-ray computed tomography (CT) system for battery, semiconductor devices, electronic components, and advanced materials analysis. The system is developed in collaboration with Excillum AB, the global source for X-ray innovation.
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Renishaw has launched a new family of RLE laser interferometer encoder systems. The new product range comprises three systems – RLE100, RLE200 and RLE300 – providing precision position feedback for a wide range of semiconductor manufacturing motion control applications.
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FARO CREAFORM will showcase its latest portable metrology technologies at IMTS 2026 (Booth 134730), from September 14 to 19 in Chicago. Visitors can explore solutions designed to enhance inspection efficiency, support quality workflows, and enable data-driven decision-making across the production floor.
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The Association for Advancing Automation (A3) has announced the speaker lineup and agenda for its Advanced Vision & AI Conference, September 23–24, 2026, in Santa Clara, California. Featuring experts from Waymo, NVIDIA, Tesla, Intrinsic, GE Vernova, Intel, FANUC, Cognex, Siemens Digital Industries, and more, the two-day conference will focus on how vision and AI technologies are being deployed across manufacturing and other industrial environments.
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QuantumDiamonds GmbH (QD) has demonstrated a novel method for imaging electrical current inside a semiconductor structure without making physical contact with it. The technique removes the constraint that has kept quantum-sensing based current imaging inside the failure analysis lab and marks the foundational step on QD’s path toward inline inspection in high-volume manufacturing.
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