Teledyne DALSA, a leader in machine vision technology, has announced the release of its next-generation Linea HS2 8k backside illuminated (BSI) 1 MHz Time Delay Integration (TDI) camera.
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Goods-in operations in the electronics industry are under increasing pressure. Countless components from a wide range of manufacturers arrive with constantly changing label layouts, multilingual markings and ever shorter throughput times.
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Cognex Corporation, the global leader in industrial machine vision, has announced the general availability of OneVision, its collaborative AI vision development environment designed to simplify and scale AI-powered inspection across manufacturing operations.
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When evaluating an AI visual inspection system, most engineers focus on detection accuracy, camera resolution, and throughput. The deployment architecture question, whether inference runs at the edge or in the cloud, often gets treated as a secondary decision. It should not. Where your AI model runs determines whether your inspection system can function at all under real production conditions.
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General Inspection has announced the launch of the Gi-307, a powerful new fastener inspection and sorting platform designed to redefine quality control for manufacturers producing mission-critical screws and bolts.
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Zaber Technologies has announced the DMA Objective Focus Stage, a compact, linear motor solution for microscope system builders and OEM manufacturers. The DMA delivers 50 nm repeatability and 10 nm minimum incremental moves, providing comparable precision to piezo stages at one-third the cost.
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Nikon Corporation has launched the ECLIPSE LV100AMS, a new one‑click automated microscope designed to simplify industrial inspection and quality control. Built on Nikon’s established industrial microscope platforms, the LV100AMS combines fully automated inspection with AI‑powered image analysis, enabling manufacturers to improve consistency, increase inspection speed, and strengthen confidence in inspection outcomes.
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Allied Vision has announced the 3DPIXA evo compact CXP, a series of high-performance line scan 3D stereo cameras that fuse GPU – accelerated stereo algorithms with high-resolution 2D color imaging for simultaneous 3D depth map data and RGB output in machine vision inspection.
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Airy3D has announced that its DepthIQ SDK is supported on the MediaTek Genio Series of System-on-Chips, enabling compact and cost-efficient passive 3D vision solutions for embedded AI vision applications across robotics, industrial, retail, and smart devices.
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A new technique called quantum diamond microscopy (QDM), now entering commercial deployment in semiconductor laboratories across the US, Europe, and Asia, offers the industry something it has lacked: direct, non-destructive measurement of electrical current flow inside a fully assembled device.
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