ZEISS has introduced the ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers understand samples faster. Combining X-ray microscopy and microCT in a single platform, the system delivers multi-scale imaging, guided workflows, and automated AI-enabled reconstruction for efficient non-destructive 3D imaging.
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Vision Engineering has announced EVO Cam AURA, its new digital microscope platform for industrial inspection, quality control and laboratory analysis.
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Optical Gaging Products (OGP), a leading manufacturer of precision optical and multisensor metrology systems, has announced the introduction of SmartScope E18, a high-capacity benchtop video measurement system that delivers fully automatic 3-axis measurement performance in a compact footprint.
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Teledyne e2v has announced Flash 1K2 and Flash 8K, the latest additions to its Flash CMOS image sensor family. The new sensors join the existing Flash 2K and Flash 4K devices, extending the portfolio from 1K to 8K resolutions.
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Sensofar has announced the introduction of the S neox 6, the latest generation of its optical 3D surface metrology platform. Designed to support measurement needs across industry and research, the new system expands measurement possibilities while making the entire process faster, easier, and more intuitive.
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FIBERSCOPE has reintroduced the iX3D 3D measurement video borescope, a modular remote visual inspection system that has been developed in the U.S. with German optical engineering and is intended for use in cases where detecting an internal defect alone is insufficient.
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A new robotic inspection system designed to automate the assessment of gear cutting tools is making its first public appearance at IMTS 2026 in Chicago.
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QuantumDiamonds GmbH (QD) has demonstrated a novel method for imaging electrical current inside a semiconductor structure without making physical contact with it. The technique removes the constraint that has kept quantum-sensing based current imaging inside the failure analysis lab and marks the foundational step on QD’s path toward inline inspection in high-volume manufacturing.
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PI (Physik Instrumente), a leader in piezo nanopositioning and air bearing technology, offers the P-733 XYZ piezo nanopositioning stage, delivering 0.1 nm (1 Å) positioning resolution for demanding applications in super-resolution microscopy, atomic force microscopy (AFM), surface nanometrology, and advanced imaging.
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IDS Imaging Development Systems is expanding its 3D portfolio with Nion, an industrial ToF camera featuring 1.2-megapixel resolution and integrated depth processing. It provides high-resolution and temporally stable depth information at 30 fps, even during rapid movements and in changing lighting conditions.
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