Laser Thermal Partners With NIST To Advance Semiconductor Research With Thermal Measurement Tool
In a significant boost for semiconductor research and development, Laser Thermal has announced a new collaboration with the National Institute of Standards and Technology (NIST). Laser Thermal has been awarded a contract to supply NIST with its groundbreaking thermal conductivity measurement tool, the Steady State Thermoreflectance in Fiber (SSTR-F). This partnership is set to advance the CHIPS for America Metrology Program, an initiative aimed at enhancing the accuracy and precision of microelectronic materials and devices.
Elevating Thermal Measurement Capabilities
The SSTR-F tool represents a major leap forward in thermal property measurement. Designed to assess the thermal conductivity of thin films, interfaces, and bulk materials, the SSTR-F is particularly suited for wide bandgap power electronics and packaging materials. Unlike traditional methods, which often involve complex and custom-built systems, SSTR-F is the first commercially available instrument to offer reliable measurements at these critical length scales.
This non-contact, non-destructive optical measurement technique provides unique insights into the thermal properties of multilayer material structures. The ability to conduct precise and spatially resolved measurements makes SSTR-F a valuable asset in research environments where accuracy is paramount.
Supporting the CHIPS for America Initiative
The CHIPS for America Metrology Program is a vital component of the broader CHIPS for America initiative, which aims to bolster the U.S. semiconductor industry. The program addresses seven grand challenges in metrology:
Materials Purity, Properties, and Provenance: Ensuring the integrity and quality of materials used in semiconductor manufacturing.
Advanced Manufacturing Metrology: Developing new measurement techniques for cutting-edge manufacturing processes.
Integrated Packaging Components: Enhancing measurement methods for advanced packaging technologies.
Semiconductor Materials and Designs: Improving the modeling and simulation of semiconductor materials and designs.
Manufacturing Processes: Refining the modeling and simulation of semiconductor manufacturing processes.
Standardization: Setting standards for new materials, processes, and equipment in microelectronics.
Security and Provenance: Ensuring the security and traceability of microelectronic components.
Laser Thermal’s SSTR-F aligns perfectly with these goals, offering NIST a robust tool for addressing some of the most pressing challenges in semiconductor metrology. By providing precise thermal conductivity measurements, SSTR-F will contribute to the development of reference materials and standards crucial for advancing semiconductor technology.
“While thermoreflectance is a powerful measurement technique, these tools are traditionally homemade, requiring dedicated and experienced staff. Laser Thermal is the first company to commercialize a thermoreflectance instrument based on our patented SSTR-F technology, enabling direct measurements of thermal conductivity and resistance. We are thrilled to work with NIST and contribute to the advancement of metrology in microelectronics manufacturing” states John Gaskins, co-founder and CEO of Laser Thermal.
As the semiconductor industry continues to evolve, especially with the increasing demand for high-performance applications like AI and large-scale data centers, effective thermal management becomes ever more critical. The SSTR-F tool will play a crucial role in validating and improving thermal measurement methods, providing valuable data and protocols to guide future product development and research.
For more information: www.laserthermal.com
