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Next Level Bow Warp Wafer Measurement Systems Announced

NADA Technologies has recently announced that its fully automated solution for 150/200 and 300mm Wafer Bow Warp measurement fully meets customers target specifications at a fractional price of existing solutions and with a significant throughput improvement.

NADA Technologies (NADAtech) is known for engineering dual and triple functionality into their automation solutions for increased capacity and yield while minimizing equipment footprint. The Bow Warp add-on module continues this trend. Utilizing an award-winning optical tomography sensor, the new module measures total thickness variations, bow, warp and voids in a single scan that takes only seconds, with no compromise to accuracy.

Taking measurements from just one side of the wafer, it can measure an entire 12″ wafer made from any material in a single pass, including component coatings. Added to NADAtech’s T-Series wafer sorter, the AOI capabilities bring customers a competitive advantage in measurement, inline inspection, and quality control, while also running up to three other recipes at the same time.

“We are so excited to bring this new technology to market. There has been significant interest in this new platform from multiple customers and shipments have already begun in 2023. This system will open new markets to NADAtech while offering far greater efficiency to our customers,” said Tim Ewald, CEO of NADA Technologies.

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