‘METROLOGY BREW’ News Bulletin – October 9th
Summary of headline metrology and smart manufacturing news from the past 7 days.
Read Article →Summary of headline metrology and smart manufacturing news from the past 7 days.
Read Article →To overcome limitations, the Optical Imaging and Metrology Team of KRISS introduced an artificial intelligence (AI) algorithm to the pattern projection method.
Read Article →In addition to the acoustic emission sensors, fiber-optic strain sensors are also integrated into the tanks.
Read Article →Live Monitor provides easy access to system data from any web browser at any time. The new offering has helpful dashboards to manage a fleet or drill down on printer or furnace performance in ways that assist capacity planning, maintenance management, and more.
Read Article →Cobot models are available with built-in 1.2M/5M pixel color cameras, or users can optionally use 2 GigE 2D cameras for applications requiring greater resolution.
Read Article →In the ‘CAMWear 2.0’ project, a research team from Fraunhofer IPT, together with project partners, developed a system that precisely records and evaluates the wear condition of the cutting tools almost in real time during the milling process.
Read Article →The chosen solution was to integrate Digital Metrology’s OmniSurf3D software into the workflow of Hexagon’s QUINDOS software. QUINDOS remotely and transparently executes OmniSurf3D to process the surface data and calculate the texture parameters.
Read Article →The demand for higher precision and the need to monitor complex and diverse product characteristics necessitate advanced measurement solutions. This is where multi-sensor CMMs shine.
Read Article →The rc_visard, using the SilhouetteMatch software, reliably detects the position and orientation of the flat, unordered objects on the flat paper surface and also provides the robot with the gripping points at the same time.
Read Article →The new Gocator 2610 model generates profile and surface data at up to 2.5 microns X resolution for in-liine dimensional measurement and microscopic surface defect detection on small parts such as semiconductor Ball Grid Arrays (BGAs).
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