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OMNIVISION Unveils New Global Shutter Sensors for Machine Vision Applications

OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, has announced two new CMOS global shutter (GS) image sensors for machine vision applications. OMNIVISION has created a new Machine Vision Unit, which will focus on creating innovative solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems (ITS).

OMNIVISION’s new GS sensors feature the industry’s smallest 2.2-micron (µm) backside-illuminated (BSI) pixel for high resolution in a compact design. The high-resolution, small-format GS sensors provide the highest shutter efficiency available on the market with the ability to capture high-speed moving objects clearly and accurately at high frame rates. They also feature high sensitivity, low noise and enhanced NIR quantum efficiency (QE) for industry-leading low-light performance.

Compared to the previous-generation 2.5µm frontside-illuminated (FSI) GS sensors, the 2.2µm BSI GS sensors can achieve 1.08x sensitivity with an F2.0 lens and 2.16x sensitivity with an F1.4 lens. The new OG05B1B is a 5-megapixel (MP) resolution CMOS monochrome GS sensor in a 1/2.53-inch optical format (OF). The new OG01H1B is a 1.5MP resolution CMOS monochrome GS sensor in a 1/4.51-inch OF.

“We see a huge demand in the machine vision market for 3D cameras and CMOS image sensors,” said Michael Wu, senior vice president, global sales and marketing, OMNIVISION. “With our strong technological backbone in Nyxel®, BSI and GS technology, we bring great innovation to the industry. Our new Machine Vision Unit will focus on understanding our customers’ needs and product roadmaps and address them with novel vision solutions.”

Both image sensors feature OMNIVISION’s Nyxel near-infrared (NIR) technology, which boosts QE to 700-1050nm, enabling the capture of brighter images from farther away; PureCel Plus-S stacked-die architecture for best-in-class image sensor performance; and CSP package technology for the smallest possible dimensions.

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