Yamaha Motor Co., Ltd. has announced the launch of the YRi-V 3D hybrid automated optical inspection (AOI) system, which achieves both high speed and high precision in operation, for high-end factories mounting electronic components.
The YRi-V was developed as a higher-end version of the bestselling YSi-V 3D hybrid AOI system, which is equipped with 2D inspection, 3D inspection and a 4-direction angular camera in a single machine. By adopting a newly developed inspection head equipped with a high-speed, high-resolution camera, an updated 3D projector, and a high-performance GPU, the YRi-V achieves the industry’s fastest inspection speed according to recent Yamaha Motor research. Inspection performance has been greatly improved while building on previous levels of convenience and functionality, such as raising the inspection capabilities for fine pitch ultra-small components and detecting scratches, cracks, chipped areas and the like with mirror-surface finishes, a difficulty until now.
The main features include high levels of both speed and precision by adopting a newly developed inspection head equipped with a high-speed, high-resolution camera and a high-precision 8-direction 3D projector. More functionality such as greater component inspection compatibility due to new coaxial lighting and more compatible PCB lengths via revised conveyors. Improved usability due to using AI-powered deep learning and other changes to simplify, automate and lower skill requirements for inspection data creation.
When imaging with 4 projectors versus the previous model, the YRi-V’s inspection speed (mm2/s) is about 1.6 times faster at 12 μm resolution and about 2 times faster at 7 μm resolution. Approximately twice the repeatability of the current YSi-V TypeHS2 model when measuring the height of chip components.
Data tuning time is halved by eliminating inspection frames (automatic calculation), automating lighting parameters and automatic position correction that accurately accounts for the degree of component misalignment. In addition, AI deep learning identifies the component type from the component image and automatically sets the ideal component library. It also greatly promotes further automation and labor saving, such as automating new component library creation and aiding with secondary visual checks and decisions.
Market Background and Product Outline
The reliability shown with SMT processes directly affects the market value of the products. The SMT field in recent years has seen the shift toward smaller sizes, higher densities, greater functionality and more diversification accelerate rapidly, and in order to ensure the reliability of PCBs, fast yet precise inspection of mounting quality across all items via automated optical inspection (AOI) will be even more sought after. Also more recently, the use of thin and extremely small Wafer Level Chip Size Packages (WLCSP) and Fan Out Wafer Level Packages (FOWLP), which have specular gloss on the package surface, has risen significantly in the market. So, in addition to mirror-surface components that are difficult to inspect, the need for compatibility to mount ultra-small components at fine pitch is increasing.
The YRi-V accommodates these changes and demands of the market early on. This AOI system dramatically improves inspection ability in terms of both speed and accuracy, with greater detection capability for 0201 size (0.25 mm x 0.125 mm) ultra-small components and mirror-glossed components.
In addition, with our unique 1-Stop Smart Solution concept, we take advantage of being the industry’s leading manufacturer with a full lineup of SMT equipment— from SMD storage, solder paste printers and glue dispensers to surface mounters and AOIs—to offer new value via the high-level integration and coordination among our line equipment that removes the need for black boxes.