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Sensor Overcomes Challenges of BGA Package Inspection

SmartRay, manufacturer of 3D sensors for quality inspection and measurement, offers semiconductor manufacturers a solution to meet the challenges of ball grid array (BGA) package inspection with its dual-head ECCO 95+ sensor. 

BGA packages are used to permanently mount devices such as microprocessors and are designed for use with integrated surfaces. However, inspection of a BGA is challenging; as it is mounted face-down, with several parts stacked on top of each other, therefore inspection of the final part is difficult. The ball shape of solder also causes occlusions for traditional 3D inspection equipment using laser triangulation. 

High level accuracy and 100% inspection at rapid speed is required for the hundreds of individual chips and balls to detect contamination, scratches and missing parts, creating a challenge for many inspection sensors. 

SmartRay has introduced the dual-head ECCO 95+ sensor to overcome these BGA inspection challenges. The dual-head design allows the target to be viewed from two perspectives ensuring an occlusion-free view, and shadow-free scanning. This results in double point density.  

Mounted on a gantry axis configuration, the dual-head sensor can scan several stripes to maintain maximum resolution. This enables the high-resolution inspection to be maintained, providing a lateral resolution between 5.8 and 6.6 µm, and a vertical resolution from 0.37 to 0.45 µm.

Clare Rathsack, Business Unit Manager ECCO – Sensors, SmartRay, said: “The BGA package presents a challenge for traditional 3D inspection techniques. However, this can be overcome by using a dual-head ECCO 95+ which utilises two-camera 3D scanning for optimum target visibility whilst maintaining high resolution, high-speed scanning, increasing quality and throughput for BGA production.”

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