Optocomb sensors combined with Helical Scan by XTIA offers fast and accurate 3D inspection of production automotive components such as connecting rods.
XTIA 3D scanners can fully profile conrods in a few seconds and perform a high-resolution dimensional and visual inspection of the part. With such a high-speed and high-resolution performance, users can perform in-line quality control of manufactured conrods without human intervention. With XTIA’s metrology software, the Optocomb Suite, the whole inspection process of the conrod can be fully integrated and automated from part measurement to data processing and quality assessment.
The Optocomb Suite allows automatic processing of the generated high-resolution Optocomb 3D data automating dimensional inspection. Users can generate custom recipes, automatically detect part features, and instantly perform quality control of the connecting rod including positional deviation, flatness, straightness, parallelism, diameter and roundness. The dimensional inspection results can be archived and leveraged for process optimization.
The presence of microdefects in the bores of connecting rod can be especially detrimental to the assembly process and its functional operation. Detecting such small defects in bores can be a difficult task however, with Helical Scan by XTIA, it’s possible to dive deep into the connecting rod bores and perform visual inspection of their inner walls with a resolution down to 2μm. Manufacturers can thus detect and identify 3D microdefects, and extract their size in all three dimensions.
Leveraging the unique coaxial configuration of Optocomb lasers, XTIA sensors can be combined with a rotating mirror which powers the Helical Scan system. The unique optical sensor can measure the inner walls of cylindrical structures with micro-accuracy. Until now, the in-line inspection of such inner surfaces in 3D with micro-accuracy has remained elusive. It is especially the case for bores, as accessing visual and dimensional information deep into cylindrical structure while delivering micrometer-level accuracy is a significant challenge.
For more information: www.xtia.co.jp