The ever-increasing development pace and diversity of electronic appliances means increasing production challenges in printed circuit board assembly (PCBA), a complex process that involves numerous component suppliers, sophisticated assembly machines
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Helmee Imaging Oy, a developer, manufacturer and marketer of unique CSD imaging technology for challenging surface inspection applications, has launched Helmee Imaging, Inc., a wholly owned U.S. subsidiary based in
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Voltera, a manufacturer of additive and printed electronics technology, has announced the launch of NOVA, a groundbreaking manufacturing platform for printing flexible hybrid electronics. NOVA uses direct-write technology to print
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ABB is entering into a strategic partnership with US-based startup Scalable Robotics, to enhance its portfolio of user-friendly robotic welding systems. Through 3D vision and embedded process understanding, the Scalable
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3D scanning and data processing software platform, from Artec3D only recently received game-changing enhancements is getting yet another boost with the latest build, Artec Studio 17.1. While more major updates
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Read a quick summary of metrology and smart manufacturing news from the past 7 days. ZEISS Launches ScanBox Series 5 ZEISS Industrial Quality Solutions has expanded its range of optical
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Hexagon AB has announced that David Mills will succeed Robert Belkic as Chief Financial Officer (CFO) for Hexagon AB, effective 1 July 2023. David Mills, currently CFO of Hexagon’s Manufacturing
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KLA Corporation has announced plans to build a new research-and-development and manufacturing center for the SPTS division, in Newport, Wales, UK. The new development designed to meet BREEAM standard of
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Rigaku Corporation, manufacturer of X-ray analysis and inspection equipment, has launched their new XSPA-400 ER (X-ray Seamless Pixel Array) detector to the global market following a recent successful domestic launch.
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Metrology has a pivotal role to ensure the vision of fifth generation (5G) and emerging wireless technologies to be realised. It is essential to develop the underpinning metrology in response
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