Edmund Optics has expanded its TECHSPEC HP Series Fixed Focal Length Lenses with the introduction of a new 6.5mm focal length, extending the series’ high-resolution imaging performance to machine vision applications that require shorter working distances and wider angular fields of view.
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With the smartWLI nimbus8 and firebolt8, GBS metrology presents two high-end surface measurement sensors designed for demanding industrial and scientific applications. B
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Commencing immediately the machine vision brands Allied Vision, Chromasens, Mikrotron, NET, and SVS-Vistek will be consolidated under the Allied Vision brand. The companies, which are all part of the TKH
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Rigaku Corporation, a solution partner in X-ray analytical systems has announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump structures for wafer-level processes.
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Advantech, a global provider of intelligent IoT systems and embedded platforms, has announced the launch of MIPI-C (MIPI over Type-C), a new open specification that brings standardization to AI robotics and machine vision. Advantech MIPI-C solves long-standing challenges of traditional MIPI CSI cameras, including cable design limitations, interference, short transmission distance, and complex multi-camera integration.
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With its new AI camera TIV, TURCK promises a paradigm shift in industrial image processing: Instead of complex programming, the intelligent camera only needs to be trained with a few sample images.
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UnitX, a supplier of AI-driven inline visual inspection, has announced the launch of FleX, its flagship platform engineered for manufacturing excellence. FleX is the essential platform for the toughest quality control demand, securing the highest quality, reducing the cost of scrap, and maximizing Overall Equipment Effectiveness (OEE).
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The breakthrough innovation behind WEControlDOME’s performance: automatic capture of each individual container via an integrated SVS-Vistek camera that provides consistent images across objects of varying sizes, colors, geometries and heights.
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EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, recently unveiled the EVG40 D2W – the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments.
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In modern optical manufacturing, surface quality inspection has become one of the most critical steps in ensuring product performance, reliability, and safety. From high-precision lenses and coated mirrors to semiconductor wafers, optical surfaces must meet increasingly stringent specifications.
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