EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, recently unveiled the EVG40 D2W – the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments.
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In modern optical manufacturing, surface quality inspection has become one of the most critical steps in ensuring product performance, reliability, and safety. From high-precision lenses and coated mirrors to semiconductor wafers, optical surfaces must meet increasingly stringent specifications.
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e-con Systems, a provider of embedded vision solutions, launches its first Edge AI Vision Box—Darsi Pro built on the NVIDIA Jetson platform at CES 2026 Expo taking place from January 6–9, 2026 at the Las Vegas Convention Center.
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Image-sensor innovator Singular Photonics has announced a major milestone in its strategic collaboration with Renishaw, a global leader in metrology and analytical instrumentation. The companies have been co-developing next-generation spectroscopy capabilities powered by Singular’s new suite of single-photon avalanche diode (SPAD) image sensors.
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Surfmera has announces its advanced suite of atomic force microscopes (AFM), positioning the company as a leader in nanoscale imaging and measurement solutions. Designed to empower researchers and industries, these cutting-edge instruments unlock new dimensions in material properties, chemical composition, and physical phenomena at the atomic and molecular levels.
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Machine vision is the automatic extraction of information from digital images for process or quality control. Most manufacturers use automated machine vision instead of human inspectors because it is better suited to repetitive inspection tasks. It is faster, more objective, and works continuously.
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Teledyne DALSA has announced the release of the Xtium3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.
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Nikon Corporation has announced the new ‘Digital Sight 100’ digital camera for microscopes. The Digital Sight 100 can be used in combination with full line-up of industrial microscopes and measuring microscopes.
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By integrating precision hardware, synthetic-data-trained AI, and a real-time 3D digital dashboard, the company is establishing a new benchmark for inline surface-quality verification.
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SQ5000Pro unifies Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Coordinate Measuring Machine (CMM) capabilities into a single high-performance platform signaling a major step forward in high-precision, in-line metrology and inspection for advanced electronics manufacturing.
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