Nearfield Instruments has launched Lightning Mode, a new feature for QUADRA, the semiconductor industry’s highest-throughput, in-line atomic force microscopy (AFM) metrology system for advanced semiconductor devices.
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Specim, a leading provider of cutting-edge hyperspectral imaging solutions, recently announced the launch of its new macro lens for the Specim FX10 hyperspectral camera.
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The Metrios range offers a wide choice of models and degrees of accuracy, making it the perfect measurement solution for all types of components: from automotive, aerospace and medical to semiconductors and micro-components. With Metrios, it is possible to check dozens of dimensions in a matter of seconds with a single program, both single-piece and multi-pieces.
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The next phase of the ongoing development of the industrial sector is being referred to as Industry 5.0, or 5IR for short. Rather than launching a revolution, 5IR seeks to expand on the foundation established by its predecessor, Industry 4.0, which forever disrupted the industrial landscape by introducing big data, automation, cloud computing, artificial intelligence, M2M and the Internet of Things (IoT).
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Kistler and Nidec SYS have announced a new Inline Vision & Weld quality assurance system – a fully integrated solution for stamping technology. The system is the only one of its kind to combine the optical quality inspection of punching strips from Kistler with the precise servo-controlled cutting and laser welding technology from Nidec SYS. Inline Vision & Weld enables users to wind exclusively OK parts onto the punched part coil in a seamless strip.
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Researchers have demonstrated a new intelligent photonic sensing-computing chip that can process, transmit and reconstruct images of a scene within nanoseconds. This advance opens the door to extremely high-speed image processing that could benefit edge intelligence for machine vision applications such as industrial inspection, autonomous driving, and robotic vision.
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Artificial Intelligence, edge computing, and Industry 5.0 are machine vision trends that necessitate high-density computer controlled I/O signals for devices ranging from strobes and solenoids, to actuators and photo detectors. Purchasing an I/O card has been the solution up until recently, but this step necessitates additional expenses, software, system complexity, and the use of a host PC slot.
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With the launch of its Inspector83x 2D vision sensor, SICK has enabled out-of-the-box Artificial Intelligence machine vision inspections for common inline inspection tasks in demanding high-speed production.
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PI, a leader in nanopositioning and motion control, is offering granite-based multi-axis precision motion systems for the automation of wafer metrology, glass substrate inspection and lithography applications.
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The uEye XS from IDS Imaging Development Systems weighs just 12 grams and fits into almost any application with its size of just 26.4 x 23 x 21.7 mm.
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