Rigaku Corporation, a solution partner in X-ray analytical systems has announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump structures for wafer-level processes.
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In the rapidly maturing pickleball market, the gap between good and great has narrowed to just a few percentage points. For elite paddles, performance differences between top brands can be as small as five percent—nearly indistinguishable without precise measurement. At this level of refinement, incremental improvements are no longer enough
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Nikon Corporation has announced a comprehensive suite of enhancements to its XT V Series X-ray and CT systems, strengthening the platform’s position as a world-class solution for non-destructive inspection of electronic components.
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Thermal management is critical for high-performance computing and modern electronics. AI accelerators, semiconductor equipment, and laser systems are all shrinking in size while increasing in power. With more watts concentrated in tighter spaces, engineers are hitting the thermal wall faster and more frequently.
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The team sees this as a major advancement for X-ray technology with a wide range of uses, from airport security and quality control to nondestructive testing and advanced manufacturing. They also hope its impact will improve medical diagnostics.
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Lumafield has announced Auto-Dimensioning, a robust new capability that provides engineers with easy, automated methods for Geometric Dimensioning and Tolerancing (GD&T). By delivering NIST-traceable measurements directly within its CT platform, Lumafield provides engineers with metrology-grade accuracy and fast, efficient dimensional workflows without the complexity or limitations of traditional inspection tools.
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Imagine a world where high-resolution CT scans of complex components don’t require shipping parts to specialized laboratories, waiting days for results, or halting production lines. This is no longer a future scenario—thanks to SCANEXPRESS, a mobile CT system developed by Microvista GmbH, this capability is now a reality.
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DÜRR NDT has introduced instaNDT, a next-generation Picture Archiving and Communication System (PACS) purpose-built for non-destructive testing (NDT) applications. Designed to combine traditional PACS functionality with modern enterprise-grade features, instaNDT offers a flexible, web-based platform for managing, sharing, and analyzing inspection data across multiple modalities and teams.
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Lumafield has released the results of a study evaluating the safety and quality of lithium-ion batteries. The research evaluates more than one thousand 18650 lithium-ion battery cells from ten brands and reveals an enormous gap in quality between brand-name batteries and low-cost cells that are widely available through online marketplaces.
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Hexagon has announced the release of VG Software 2025.3, bringing significant improvements to its industry-leading CT-scan data analysis platform. Central to this update is the newly redesigned Porosity & Inclusion Analysis (PIA) tool, which earlier this year received the 2025 iF Design Award for its user-friendly interface.
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