Artec 3D has announced the launch of Artec Studio Lite, a new, more accessible version of its industry-renowned software for 3D data capture and processing. Designed to make professional-grade 3D tools available to a wider audience, Artec Studio Lite delivers cutting-edge AI-powered photogrammetry alongside essential 3D processing and analysis capabilities, all in a streamlined, affordable package.
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Nikon SLM Solutions and Swedish advanced analytics and visualization technology company Interspectral have announced a strategic partnership to deliver an advanced, integrated quality assurance and process monitoring solution for industrial metal additive manufacturing (AM).
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For her outstanding contributions to the Bavarian economy, Dr. Heike Wenzel, CEO and Managing Partner of WENZEL Group GmbH & Co. KG and President of the Chamber of Commerce and Industry (IHK) Aschaffenburg, has been awarded the Bavarian State Medal
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Creaform, has announced the opening of two new service centers that will offer local ISO 17025 calibration for its EVO, BLACK, and MAX Series of the HandySCAN 3D lineup. With these new centers located in Monterrey, Nuevo León, Mexico and Exton, Pennsylvania, United States, Creaform customers in the US and Mexico can now access certified calibration locally, reducing shipping delays and downtime.
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Aibuild’s newly announced strategic partnership with Reichenbacher Hamuel GmbH marks more than the convergence of additive and subtractive manufacturing. It signals a meaningful step toward metrology-centric hybrid production, where measurement data and digital feedback loops drive consistency, accuracy, and industrial scalability.
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Renishaw’s full range of RenAM 500 series of metal additive manufacturing (AM) systems and TEMPUS technology are now integrated into the 3DEXPERIENCE virtual machine from Dassault Systèmes.
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Renishaw has announced the launch of a next-generation Build Processor (NxG BP), developed in collaboration with Materialise.
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The method is fully compatible with current semiconductor fabrication facilities and can reduce lithography defects on 12-inch wafers by 99%, representing a significant potential cost saving.
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EuQlid, a quantum technology company developing next-generation design and metrology tools, has announced its emergence from stealth mode with $3 million raised from lead investor QDNL Participations with participation from Quantonation, and over $1.5 million in early customer revenue, to deliver a breakthrough 3D imaging solution for semiconductors and batteries.
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Mitsubishi Electric Automation has announced the release of its Integrated Machine Analytics (IMA) C70 Adapter, a cutting-edge solution designed to empower manufacturers with real-time visibility into critical machine data.
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