Rigaku Corporation, a solution partner in X-ray analytical systems has announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump structures for wafer-level processes.
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The scanCONTROL 3010-200 laser profile scanners from Micro-Epsilon enable robots to precisely detect and handle flexible cables in real-time. Software synchronises the data from the sensors with the movement of the robot for precise positioning of the cables on the cable harness, providing an efficient and economical application solution.
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With its new AI camera TIV, TURCK promises a paradigm shift in industrial image processing: Instead of complex programming, the intelligent camera only needs to be trained with a few sample images.
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UnitX, a supplier of AI-driven inline visual inspection, has announced the launch of FleX, its flagship platform engineered for manufacturing excellence. FleX is the essential platform for the toughest quality control demand, securing the highest quality, reducing the cost of scrap, and maximizing Overall Equipment Effectiveness (OEE).
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AAT has announced the integration of the Hexagon Blue Light Scanning Sensor into the CAPPS-NC manufacturing platform, introducing advanced wireless communication and intelligent automatic tool changer (ATC) management for high-speed, non-contact inspection of large airframe stringers and complex structural components.
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As industries accelerate toward spatial computing, digital twins, and Physical AI, a fundamental infrastructure challenge continues to limit scale and adoption: high-fidelity 3D data can be too large to move efficiently. From factory-wide digital twins to LiDAR-based inspection environments, the sheer weight of 3D assets can become a bottleneck for real-time visualization, simulation, and collaboration.
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By adopting the Hexagon SmartScan VR800 structured light scanner, Denso now performs fast, high-accuracy, non-contact inspection of multiple parts simultaneously. This upgrade led to time savings, improved defect detection, and greater flexibility, enhancing product quality and helping Denso meet the strict standards of their global automotive clients.
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SensoPart is expanding its portfolio in the field of industrial sensor technology and revolutionizing object detection with a completely new product concept. This innovative solution combines the flexibility of a smart camera with the ease of use of a 1D sensor in a compact device – and in 3D.
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EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, recently unveiled the EVG40 D2W – the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments.
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MachineMetrics, a production intelligence platform, recently announced the launch of Max AI, a new AI-powered intelligence layer for its next-gen Manufacturing Execution System (MES) platform. Max AI unifies data from machines, ERP, and tribal knowledge to deliver a revolutionary agentic digital workforce for discrete manufacturers.
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