Nordson Unveils SQ5000Pro Multi-Function AOI, SPI, and CMM Platform
Nordson showcased the global debut of its SQ5000Pro Multi-Function system, at the recent Productronica 2025 exhibition in Munich, Germany. SQ5000Pro unifies Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Coordinate Measuring Machine (CMM) capabilities into a single high-performance platform signaling a major step forward in high-precision, in-line metrology and inspection for advanced electronics manufacturing.
At a time when miniaturization, high-density packaging, and complex architectures are challenging the limits of traditional inspection tools, Nordson’s new platform promises to set a new benchmark for speed, accuracy, and measurement depth.
New Standard for Multi-Function In-Line Inspection
The SQ5000Pro integrates AOI, SPI, and CMM measurement into a unified system engineered for superior defect detection, high-resolution metrology, and rapid in-line performance. It delivers comprehensive measurement capabilities in mere seconds, allowing manufacturers to close quality loops faster and react to process variability in real time.
Central to this platform is a new coordinate measurement software suite, designed to capture critical dimensional, positional, and volumetric data with the precision expected from standalone CMM systems—yet at the speed required for high-volume SMT and advanced packaging lines.
This combination of inspection detail and production-level throughput presents a significant advancement for factories striving toward Industry 4.0 and adaptive manufacturing ecosystems.
Next-Generation Sensors: Eliminating Reflection Distortion
The SQ5000Pro is powered by two new sensors in Nordson’s 500-series Multi-Reflection Suppression (MRS) family—the HR (High Resolution) and HS (High Speed) variants. These advanced sensor options deliver breakthrough performance due to MRS technology, which eliminates reflection-based distortions that typically plague inspection of shiny, curved, metallic, or specular surfaces.
This capability is essential for modern assemblies where surface finishes are diverse and geometries are increasingly complex. With MRS enabled distortion suppression, the SQ5000Pro ensures measurement integrity and repeatability even under challenging optical conditions.
The result is an inspection system that can confidently handle the growing variety of materials and coatings found in sectors like advanced packaging, automotive electronics, medical devices, and high-reliability computing.
Engineered For Demanding Applications
With its ultra-high accuracy, advanced optics, and CMM-capable software architecture, the SQ5000Pro is tailored for applications where traditional AOI or SPI may fall short. Applications include:
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Advanced semiconductor packaging
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Advanced SMT assembly
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0201 metric component inspection
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Socket and connector metrology
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Miniaturized and high-density PCB assemblies
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Precision measurement of critical geometries
These application areas require meticulous measurement of tiny structures, tight tolerances, and zero-compromise quality. The SQ5000Pro aligns with the increasing importance of co-planarity, solder joint integrity, micro-bump validation, and 3D structural measurements demanded by the industry’s shift toward chiplets, heterogeneous integration, and fine-pitch interconnects.
AI-Driven Automation with AutoProgram
To support rapid deployment on production lines, the SQ5000Pro features the latest generation of Nordson’s AutoProgram, an advanced AI-powered tool within the Nordson Intelligence ecosystem.
AutoProgram automates the traditionally time-consuming setup phase by:
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Reducing programming time from hours to minutes
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Automatically identifying features and regions of interest
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Minimizing operator interaction
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Optimizing inspection parameters based on real data
This dramatically shortens the path from installation to full production readiness while reducing dependency on expert-level programmers. With AI guiding inspection strategy and measurement recipes, manufacturers gain both speed and consistency—essential qualities for high-mix, high-complexity operations.
Driving the Future of In-Line Metrology
The launch of the SQ5000Pro positions Nordson at the forefront of the rapidly evolving metrology and inspection landscape. As electronics continue to shrink, diversify, and scale in complexity, the need for multi-function in-line inspection systems has become paramount. By merging AOI, SPI, and CMM capabilities, the SQ5000Pro provides a transformative approach that transcends the boundaries of conventional inspection equipment.
Manufacturers seeking higher yields, increased process visibility, and more actionable production intelligence stand to gain significantly from this platform. With powerful new MRS sensors, next-level measurement accuracy, and AI-driven automation, the SQ5000Pro is built to support the next generation of advanced manufacturing where precision and speed must coexist. In-line metrology with intelligent, multi-functions will define the factory of the future.
For more information: www.nordson.com
