PI, a leader in nanopositioning and motion control, is offering granite-based multi-axis precision motion systems for the automation of wafer metrology, glass substrate inspection and lithography applications.
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The uEye XS from IDS Imaging Development Systems weighs just 12 grams and fits into almost any application with its size of just 26.4 x 23 x 21.7 mm.
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Accurex Measurement, a leading precision measurement and inspection solutions provider in USA, has announces the launch of the LYNX2 visual inspection system. LYNX2, named after its advanced capabilities and feline-like precision, is designed to transform the landscape of automated machine vision inspection to manufacture aerostructures and other large assemblies.
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GBS, a leading company in optical 3D sensors based on coherence scanning (white-light) interferometry, has announced that it now offers complete wafer measurement systems configured for use under clean room conditions.
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Aven, a full-service technology provider, has introduced the new Cyclops 4K Ultra HD Digital Microscope. This breakthrough instrument increases accuracy and productivity while easing eye strain and user fatigue – valuable benefits in high-volume applications, such as parts inspection in assembly operations.
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The guideline VDI/VDE/VDMA 2632 Part 2 provides instructions for the creation of a requirement specification for industrial image processing systems and thus supports communication between suppliers of image processing systems and users in the project phase.
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FLIR, a Teledyne Technologies company, has announced the FLIR A6301, a cooled-core longwave thermal imaging camera designed for 24/7 inspection and automation applications aimed at making production lines more efficient and improving product quality.
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OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, has announced two new CMOS global shutter (GS) image sensors for machine vision applications. OMNIVISION has created a new Machine Vision Unit, which will focus on creating innovative solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems
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Aberlink’s CCD Camera option for its cartesian CMM range has been significantly improved with the launch of a fully automated and motorized collimated lightbox. Having a 300 x 300mm X-Y measuring range, the collimated light solution enables intricate turned parts to be measured with outstanding accuracy.
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SYLVAC recently unveiled the integration of the Renishaw SP25M tactile 3D scanning probe into its SYLVAC-SCAN S145 optical measurement machine. This upgrade enhances the machine’s capabilities, providing a multi-sensor solution that detects features beyond optical reach. Specifically designed for measuring holes and slots in cylindrical components, the enhanced system is identified as the SYLVAC-SCAN S145 P.
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