SVS-Vistek has announced the launch of an ultra-high resolution industrial camera that merges the power of a Sony 245.8-megapixel CMOS area sensor with the lightning-fast CoaXPress-12 (CXP-12) quad interface.
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Teledyne DALSA has announced the new Tetra™ line scan camera family. Designed for a wide range of machine vision applications, Tetra leverages Teledyne’s latest multiline CMOS image sensor technology and builds on the success of the original Linea™ series of high-value line scan cameras.
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Chromasens, a brand of TKH Vision, continues to bring robust solutions to the machine vision industry with its 3DPIXA wave dual 7μm stereo line scan camera with factory-calibrated lens.
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Blaize Holdings, Inc. (Blaize), a provider of purpose-built, artificial intelligence (AI) enabled edge computing solutions, recently announced a strategic partnership with alwaysAI, a leader in computer vision solutions.
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With Simatic Robot Pick AI Pro, an industrial vision AI for the development of AI-supported picking robots, Siemens demonstrated how the combination of software-defined and data-driven automation creates more adaptability and flexibility in automation solutions in order to overcome the challenges and complexity of today’s intralogistics and to offer future-proof solutions.
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XIMEA continues to push the frontiers of industrial imaging with the launch of the MX2457 camera, a groundbreaking innovation that delivers exceptional resolution and performance. At its core, this advanced imaging solution integrates Sony’s latest IMX811 medium format sensor, offering an unprecedented 245.7 MP resolution.
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The One-Cam-Connect bundle consists of an industrial switch with built-in voltage control paired with a power supply that can be plugged into any standard power outlet. It is important to know, that it includes the first 90-watt power supply for single-camera applications with IP67 protection and industrial certification.
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While machine vision uptake is expected to increase significantly over the coming years, implementation challenges are holding back manufacturers from tapping into its game changing potential.
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First invented in 1965, laser cutting technology works by directing the output of a focused laser beam onto a metal workpiece, vaporizing or melting the metal and creating a cut edge. Because of its non-contact characteristics, this technique prevents mechanical stress on the workpiece while maintaining extremely high cutting precision.
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The Inspekto S70, from Siemens, is an innovative autonomous machine vision system designed to simplify the setup and execution of visual inspections for parts and assemblies, even those with complex geometries.
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