Applications

Before relying on portable 3D scanners with high-resolution capabilities over large parts, Siemens Energy depended on manual field surveys using photos and conventional tools to carry out its tasks. However, it was common to encounter incomplete or unreliable information, resulting in delays or reduced efficiency during repair and maintenance.

To enhance the precision, accuracy and reliability of its manufacturing processes, steering component manufacturer, Pailton Engineering, has invested further in its optical scanning technology.

Savoy Moulage, a flagship subsidiary of the Savoy International group specializing in the injection of technical plastic parts and the design of injection molding tools, is a reference in the

Allowing for faster, more accurate batch inspections and maintaining tight tolerances, particularly in the measurement of micro pins, the implementation of the Baty Venture FV has boosted inspection speed whilst simultaneously increasing accuracy and repeatability.

In order to build a more efficient inspection system, there was a growing need to streamline part program creation, eliminate dependency on individual staff, and shorten lead times by implementing offline teaching.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometers.

Dodman’s adoption of Mesh2Surface came alongside the integration of 3D scanning into their operations recognising the potential benefits of incorporating a professional-grade reverse engineering solution into their process.

The main task is to ensure the dimensional accuracy of the plastic items produced. This includes measurements for initial sample test reports, measurements during series production as well as ensuring machining production.