ZEISS has introduced two new advanced models of the ZEISS Xradia Versa family: The ZEISS Xradia 610 & 620 Versa X-ray microscopes excel through faster non-destructive imaging of intact samples without sacrificing resolution and contrast over the full range of power and kV.
Leading researchers and scientists across the world rely on the signature Resolution at a distance (RaaD) capability of ZEISS Xradia Versa microscopes, ensuring the highest resolution is maintained across longer working distances, to produce remarkable scientific insights and discoveries. The rapid rate of technology advancements today requires fast analytical instruments that can keep up the pace. The ZEISS Xradia 600-series Versa is designed for this challenge.
The two biggest challenges in X-ray computed tomography are maintaining resolution on large sample sizes even at long working distances while simultaneously maximizing resolution and X-ray flux for greater throughput. Both instruments address these challenges: they provide a high-power X-ray source for significantly higher X-ray flux. This leads to faster tomography scans and therefore up to two times higher throughput – without compromising spatial resolution.
Benefits for a broad range of application fields in advanced research and industry
Academic shared-use facilities as well as industrial customers will derive maximum value from the faster image acquisition of these new versatile instruments. By serving more users with different requirements and improving instrument utilization, these facilities will make the microscopes accessible to everyone and accelerate their research and discovery.
RaaD capability enables researchers to non-destructively characterize the 3D microstructure of materials in controlled environments to understand the impact of different factors such as heating or compression (in situ experiments). The ZEISS Xradia 600-series Versa provides insights into the morphology of energy materials and their behavior under operating conditions. RaaD technology allows intact battery cells to be imaged at high resolution – enabling longitudinal studies of aging effects, across hundreds of charge cycles.
In electronics and semiconductor industries, users typically perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages.
In the additive manufacturing industry, typical X-ray microscopy applications include studying detailed shape, size, and volume distribution of particles in powder beds to determine appropriate process parameters, as well as surface roughness analysis of inner structures that cannot be accessed by other methods.
In the raw materials industry, the new ZEISS Xradia Versa X-ray microscopes provide the most accurate 3D nanoscale support for digital rock simulations, laboratory-based diffraction contrast tomography (LabDCT), and multiscale imaging at faster run times.
In life sciences, the ZEISS Xradia 600-series Versa enables faster and higher resolution imaging allowing researchers to study soft tissue such as neural tissue, vascular networks, cellular structures, ligaments, nerves; mineralized tissue such as bones; and plant structures such as roots and cellular structures.
ZEISS X-ray microscopes are designed to be upgradeable and extendible with future innovations and developments to protect our customer’s investment. This ensures the microscope capabilities evolve with the advancements in leading edge technology. From ZEISS Xradia Context microCT, to ZEISS Xradia 500/510/520 Versa, and now with the addition of ZEISS Xradia 610/620 Versa, users can field-convert their systems to the latest X-ray microscopes.
For more information: www.zeiss.com