As devices continue to scale, so do process tolerances, driving the need for better accuracy and repeatability of measurements. Whether used in the precise vehicle airbag deployment, consistent rhythm of a pacemaker or simply for sharing life events on social media, technology trends are driving smarter, thinner and lighter electronics with more functionality than previous generations.
Rudolph Technologies has announced it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in the fourth quarter 2018 to the largest OSAT (Outsourced Semiconductor Assembly and Test) where the Dragonfly G2 systems displaced incumbent 3D technology. The remaining systems will ship in the first half of 2019 to OSAT, IDM, and Foundry customers who are adopting the Dragonfly G2 platform for its high productivity in 2D inspection, and its accuracy and repeatability in three-dimensional 3D inspection of the smallest copper pillars.
The new Dragonfly G2 platform delivers up to 150% improvement in productivity over legacy systems as well as exceeds competitive system throughputs. 2D imaging technology provides fast, reliable inspection for defects down to one micron. Rudolph’s patented Truebump™ Technology combines multiple 3D metrology techniques to deliver 100% bump height offering fast throughput, increased brightfield and darkfield sensitivity and solves site alignment challenges for large die.
When stacking multiple devices to increase functionality, the interconnects become the most critical aspect of quality. Because those connections are so vital, the 3D bump measurements need to be absolutely accurate. Truebump Technology combines multiple 3D metrology techniques that deliver industry-changing performance for measuring 100% bump height on wafers at speeds that have not been possible until now. Whether measuring copper pillar bumps, micro bumps, or large C4 bumps, confirming the coplanarity of the bumps on a device is paramount to device reliability.
High-speed, accurate bump measurements are achieved with a short wavelength laser and a proprietary sensor that collects data at extremely high data rates. Multiple objectives with programmable stray light control enhances application-specific capabilities. Scanning large bumps with one pass is accomplished with a high depth of focus.
A single wafer may contain millions of bumps, each with multiple data points for height, diameter, location, and more. The massive amounts of data generated during inspection can be overwhelming to analyze. The Dragonfly system’s integrated Discover® Defect Software gives users the analytical tools to visualize
data, correct coplanarity variations, and improve yields.
The Dragonfly G2 system is tightly integrated with control and analytical software for real-time analysis and review, IR defect review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users have the analytical tools to visualize data, correct process variations and improve yields.
The Dragonfly G2 platform has been specifically architected to allow the measurement, data collection, and analysis of bump interconnects nearing 100 million bumps per wafer using Rudolph’s Discover software and advanced computing architecture.
“We are pleased that our leading-edge customers across multiple market segments are quickly recognizing the value of the Dragonfly G2 system,” said Michael Plisinski, chief executive officer at Rudolph. “Today’s interconnects for advanced memory are now at or below five microns, which require higher accuracy and repeatability versus standard copper pillar bumps. With approximately 65 wafer-level packages in today’s high-end smartphones, a single weak interconnect or reliability failure can result in a high cost of return, driving our customers’ need for the enhanced process control performance. Defect sensitivity, resolution, and productivity are combined in the Dragonfly G2 system to deliver a capability and cost of ownership that is unparalleled in the competitive space.”
For more information: www.rudolphtech.com