CyberOptics is to present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation ‘Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration’ at the IEEE PAINE Conference.
Advanced Packaging (AP) and wafer level packaging (WLP) continue to be among the most dynamic and rapidly evolving areas of semiconductor development and manufacturing. Most of these new processes take advantage of the third dimension, going vertical to continue packing more computing power into less space while circumventing the difficulties posed by further reductions in two-dimensional size.
As the processes and features they create have become smaller and more complex, manufacturers face an increasing need for high-precision inspection and measurement to detect defects and improve process control. This need is amplified by the fact that these processes use expensive known good die, making the cost of failure extremely high. Bump metrology is fundamentally three-dimensional and bump height is just as important as size and location. Controlling bump height, both absolute and relative to neighboring bumps (coplanarity), is critical to ensuring good, reliable connections between stacked components.
Multiple Reflection Suppression (MRS) sensor technology addresses this challenge by comparing data from multiple perspectives and fringe frequencies to identify and reject these spurious signals. The sensor’s unique optical architecture and the system’s proprietary image fusing and processing algorithms provide accurate 3D characterization that is several times faster than conventional PSP. MRS sensor technology in the Multi-Function System has been widely adopted for high-precision inspection and metrology for surface mount technology (SMT) and semiconductor applications. The NanoResolution MRS sensor has been developed specifically for AP and WLP applications to improve yields and process control.
The MRS sensor integrated into CyberOptics’ WX3000 system provides sub-micrometer accuracy on features as small as 25µm. While retaining its ability to reject spurious multiple reflections, it adds the ability to capture and analyze specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing accurate inspection and 3D metrology of these critical packaging features. The MRS sensor is 2-3X faster than alternative technologies. With data processing speeds in excess of 75 million 3D points per second, it delivers production-worthy throughput greater than 25 wafers (300mm) per hour. Both 3D/2D data is attained at the same time vs. time-consuming alternative methods that require separate scans for 3D and 2D. Complete 100% 3D/2D inspection can be accomplished at high speed for bump metrology, as compared to a sampling approach.
For more information: www.cyberoptics.com