Akrometrix Win Award For Its Thermal Warpage and Strain Metrology Equipment

Akrometrix, LLC, a leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, has announced that it has been awarded a 2017 NPI Award in the category of First Article Inspection for the new AXP 2.0. The award was presented to the company during a ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

“We are thrilled that our next-generation shadow moiré system – the AXP 2.0 – has won this award,” stated Mayson Brooks, Akrometrix President. “We took the feedback from all of our customers on what they needed in warpage metrology, and our engineers and manufacturing team designed/built the system in record time, under budget.”

AXP 2.0 is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.

The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample’s behavior during a user-defined thermal profile.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information: www.akrometrix.com