3D Testing Technology Event Announced

To shorten the product development cycle and reduce costs, industries, research & development institutes and universities have a growing demand on materials and component testing. In many fields, traditional measuring devices as strain gauges and linear variable differential transformers (LVDT) are replaced by GOM’s optical 3D ARAMIS testing system.

Under this background, GOM will hold the ARAMIS Tech Day 2019, a free one-day event in 3D testing, presenting new trends in full-field displacement, deformation and surface strain measurements. The ARAMIS Tech Day 2019 offers a networking platform for around 100 industry experts, testing engineers and specialists from industry and research & development at each event. Optical measuring techniques have become a standard in the industry and research & development.

The ARAMIS Tech Day 2019 will be held at three locations around the world:

  • Europe, September 24, 2019 in Braunschweig, Germany
  • Americas, October 9, 2019 in Philadelphia, USA
  • Asia, November 13, 2019 in Shanghai, China

The focus of the event will be on new developments in 3D testing technology, GOM’s software as well as the materials and component testing in the automotive, aerospace, biomechanics, civil engineering and consumer goods industries.

This years’ ARAMIS Tech Day will show how to get precise information on material properties and part behavior under load. Additionally, the participants will get to know about the customers’ firsthand user experience with 3D optical measurement. Mr. Ralf Lorenz from the Institute of Forming Technology and Machines (IFUM) at the Leibniz University Hannover, Germany, will present their project in reference to the modeling of heat release during sheet metal forming. Mr. Etienne van Daelen from the Netherlands Organization for Applied Scientific Research (TNO) shows their component testing under highly dynamic load using the ARAMIS system.

In addition to the informative presentations, four Knowledge Tracks with live demonstrations are introduced. The topics are 3D testing and evaluation in the software as well as 3D testing technologies in materials and component testing. Besides that, six communication areas give participants the opportunity to get to know the functions and features of GOM’s software as well as new developments in 3D metrology based on examples from daily practice. Testing experts help onsite with individual questions. GOM’s hardware and software partners, like InfraTec, DynaMore, Photron, HBM, AMS, GNS, exhibit and share their projects at the event.

For more information on the event and registration: www.gom.com