3D Collaboration & Interoperability Congress To Include QIF Summit

The Dimensional Metrology Standards Consortium (DMSC) and Action Engineering and are partnering to coordinate DMSC’s Quality Information Framework (QIF) Summit with the 3D Collaboration & Interoperability Congress (3D CIC). The biennial QIF Symposium, QIF Working Group meetings, and a DMSC member meeting will comprise the QIF Summit.

3D CIC is expanding to three days to feature the QIF Symposium on the third day. The joint 3D CIC and QIF Symposium event will be held October 3-5, 2017, at the American Mountaineering Center in Golden, Colorado serving as host venue for the joint event.

The DMSC’s mission includes promoting the development and interoperability of standards that support dimensional metrology such as the QIF ANSI standard. The Quality Information Framework enables the digital capture, use, and reuse of metrology-related information throughout the Product Data/Lifecycle Management (PDM/PLM) domain. The QIF Symposium will focus on the benefits and implementation success stories of the QIF standard from real users.

“After working with the DMSC team to demonstrate Model-Based Definition authoring through the QIF consumption process at IMTS 2016, I can’t wait to see how users are innovating model-based solutions using QIF in 2017,” says Jennifer Herron, CEO of Action Engineering.

“The DMSC is most pleased to collaborate our QIF Summit with 3D CIC. The Quality Information Framework is all about 3D digital interoperability within the product definition and product acceptance. This joint event will help showcase how a QIF enabled manufacturing quality organization can progress a digital product realization enterprise,” adds Curtis Brown, DMSC President.

3D CIC focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. With this year’s theme of UNITE: Engineering & Shop Floor Collaboration, real users share their experiences for all stages of the product lifecycle, with the focus on real-world challenges and solutions for turning design concepts into manufacturing product reality using 3D models.

3D CIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology, and solutions for commercial and government organizations. Presenters and attendees are real-world users representing the medical, aerospace, defense, electronics, automotive, industrial equipment, and other product development industries, with strong support by technology leaders for CAD collaboration and interoperability.

Registration for the joint 3D CIC and QIF Symposium event is open at www.3dcic.com. The early registration fee is $895 through July 31, 2017.